Shenzhen Hengtai Intelligent Digital Technology Co.,Ltd is was established in Shenzhen,located at Room 101, Building S1, Block 9, Changhuwei Industrial Zone, Tongxin Community, Baolong Street, Longgang District, Shenzhen (3rd Floor).

Company's business is closely centered around the packaging substrate industry, mainly including substrate simulation testing and manufacturing, 3D metal printing, agency of X-ray equipment, and agency of adhesives for packaging and testing

Company gets involved in the customer's product design phase, assisting with design simulation. Through interaction in chip design, packaging design, PCB DFM (Design for Manufacturability), and substrate material selection, as well as matching design rules and in-depth optimization of packaging solutions, we help customers reduce the risks associated with tape-out, minimize critical chip dimensions, enhance chip performance, shorten the chip development cycle, and reduce customer costs.